| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor processing device which is capable of keeping a substrate support uniform in temperature distribution and of detecting the temperature of the substrate support with high accuracy. SOLUTION: An insertion part 92 is formed on the side of the substrate support 34 which supports the substrate. A temperature-detecting means 94 formed of, for instance, a thermocouple is inserted into the insertion part 92. Accordingly, a hole for detecting the temperatures is not required to be provided to a heating device 58 or reflectors 62a to 62c, so that the substrate support 34 is hardly affected by the hole, the substrate support 34 can be improved in temperature distribution, the thermocouple 94 is brought into close contact with the substrate support 34, and the temperature of the substrate support 34 can be detected with high accuracy. COPYRIGHT: (C)2005,JPO&NCIPI
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