| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple mother board which can be easily divided with high accuracy even when it is small in size and sealed up with resin. SOLUTION: A marking pattern 50 is deposited in a frame-shaped waste margin 30 surrounding a plurality of board regions 20, each mounted with electronic part devices 60 on the one main surface of the multiple mother board 10, and annular grooves 40 and 41, surrounding all the board regions 20, are provided farther in the inside of the depositing position of the marking pattern but farther at the outside of the inner circumference of the waste margin region 30. COPYRIGHT: (C)2005,JPO&NCIPI
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