发明名称 BOARD MOUNTING STRUCTURE AND METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a board mounting structure of an electronic component and a board mounting method of an electronic component in which the electronic component can be removed easily from a printed wiring board while ensuring electrical connection performance and bonding strength between electrodes. SOLUTION: A connector 3 is arranged in alignment with an electrode 15. An electronic component 2 is arranged at a specified position where the electrode 15 faces an electrode 25. The electronic component 2 is moved in the direction for sandwiching the connector 3. When the electronic component 2 is moved to a specified position, an elastic substance 31 deforms to push the connector 3 into recesses 14 and 24. Since the elastic substance 31 tries to recover an original profile, a drag A is generated from the elastic substance 31 toward the sidewall part of the recesses 14 and 24. Consequently, a frictional force B is generated at the sidewall part of the recesses 14 and 24 in the direction for bringing together a printed wiring board 1 and the electronic component 2. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005108879(A) 申请公布日期 2005.04.21
申请号 JP20030336183 申请日期 2003.09.26
申请人 TOSHIBA CORP 发明人 HARADA EIICHI
分类号 H05K3/32;H01L21/60;H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K3/32
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