发明名称 METHOD AND DEVICE FOR SOLDER FEEDING, AND METHOD AND DEVICE FOR SOLDERING
摘要 PROBLEM TO BE SOLVED: To provide a method and device which can prevent deterioration of reliability on a soldered bond due to occurrence of a stringing phenomenon and can achieve accurate feeding of a proper amount of solder, when a soldering is performed with a string solder. SOLUTION: Using solder balls 11 as a solder material, they are filled in line inside a tubular member 12, picked up by a designated amount using members 13, 14 for controlling transfer of solder balls inside the tubular member and then discharged outside the tubular member. Discharged solder balls are heated and melted by a solder iron or the like and used for soldering. When solder balls are discharged, flux can be concurrently discharged together with solder balls so that corrosive action of the flux to the solder can be reduced. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005103561(A) 申请公布日期 2005.04.21
申请号 JP20030337125 申请日期 2003.09.29
申请人 TOSHIBA CORP 发明人 KOMATSU IZURU;TADAUCHI KIMIHIRO;MATSUMOTO KAZUTAKA
分类号 B23K3/06;H05K3/34;(IPC1-7):B23K3/06 主分类号 B23K3/06
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