| 摘要 |
To obtain a grinding & polishing tool for diamond and a method for polishing diamond in which a single crystal diamond, a diamond thin film, a sintered diamond compact and the like can be polished at low temperatures without causing cracks, fractures or degradation in quality therein, in addition, in which polishing operation becomes easier, polishing quality becomes stable and polishing costs become lowered while maintaining a stable performance of grinder. The grinder and the method satisfying the above requirements are: a grinding & polishing tool for diamond of which main component is an intermetallic compound consisting of one kind or more of elements selected from the group of Al, Cr, Mn, Fe, Co, Ni, Cu, Ru, Rh, Pd, Os, Ir and Pt and one kind or more of elements selected from the group of Ti, V, Zr, Nb, Mo, Hf, Ta and W; and a method for polishing diamond in which diamond is polished by pushing the above grinder against the diamond rotating or moving relative thereto while keeping the portion subjected to polishing at room temperature or, according to the situations, heating the same at 100 - 800 DEG C. |
