| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transmission line which can be miniaturized while keeping signal loss small. <P>SOLUTION: Front surface grounds 24-1 and 24-2 are copper foil patterns formed with a width A slightly wider than respective diameters of through holes 280 and 282. A backside ground 26 is a copper foil pattern covering the backside of a dielectric substrate 100 in an area opposed to an area which is surrounded with front surface grounds 24-1 and 24-2 and has a width B, and is connected to the ground (GND: omitted in Figure) The through holes 280 and 282 are provided at an interval C shorter than 1/10 of the wavelength of a signal transmitted through a signal line 12. The through holes 280 and 282 are arranged so as to be symmetrical with respect to the signal line 12. The through holes 280 and 282 pierce the dielectric substrate 10 and connect the front surface grounds 24-1 and 24-2 and the backside ground 26 so as to make them conductive. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
