| 摘要 |
<P>PROBLEM TO BE SOLVED: To measure individual operating currents of chips in an SIP structure package. <P>SOLUTION: A semiconductor device includes a first IC chip 1 for communicating with a signal from the exterior of a package, and a second chip 2 connected to the first chip in the package, in such a manner that the first chip has interface circuits 6A, 6B for supplying signals to all signal terminals of the second chip, and the interface circuits are controlled in operation to be realized to be stopped by a control signal. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
