| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem wherein short circuiting occurs between land electrodes of a component by reflow of solder, and moreover, neither packaging strength nor reliability can be acquired fully, unless resin completely enters to the lower part of an active component enough, when a ceramic modular component with the component and the active component mounted on a ceramic substrate is mounted on the mother board. <P>SOLUTION: The ceramic modular component 1 is provided with the land electrodes 4 for mounting the component 6 and the active component 8 on the surface of the ceramic substrate 13. The component 6 and the active component 8 are mounted on the land electrodes 4, and resin mold 12 is performed, to packaging surfaces of the component 6 and the active component 8. Trenches 10 are formed between the land electrodes 4 of the ceramic substrate 13, and the trenches 10 and lower surfaces of the component 6 and the active component 8 are filled with resin 9, 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
