| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing composition capable of suppressing the occurrence of a surface step difference, by suppressing the progress of dishing and the progress of erosion. <P>SOLUTION: The polishing composition contains following constituents (a) to (e), where (a): colloidal silica, (b): acid, (c): anticorrosive, (d): complete saponification polyvinyl alcohol, and (e): water. This polishing composition is used for manufacturing a wiring structure. The wiring structure is provided with an insulating film having wiring trenches on its surface, a conductor film provided to the wiring trenches, and a barrier film interposed between the insulation film and the conductor film. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
