发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition for producing a film having a uniform and fine surface appearance, and excellent transparency and slip characteristics. SOLUTION: This polyamide resin composition comprises following components: (A) a polyamide of 100 pts.wt., (B) an inorganic particle of 0.03-1.5 pts.wt. having an average particle size of 0.5-10μm, (C) a bisamide compound of a specific structure of 0.01-1.0 pts.wt., (D) calcium stearate and/or magnesium stearate of 0.01-1.0 pt.wt., and (E) a polyethylene glycol compound of 0.005-1.0 pt.wt. having a molecular weight of≤5,000. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005105167(A) 申请公布日期 2005.04.21
申请号 JP20030341639 申请日期 2003.09.30
申请人 TORAY IND INC 发明人 OKITA SHIGERU;NISHIDA KENICHI;FURUYA MASAAKI
分类号 C08L77/00;C08K3/00;C08K5/098;C08K5/20;(IPC1-7):C08L77/00 主分类号 C08L77/00
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