发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method by which a high-quality semiconductor device can be manufactured at a high yield by reducing the variation of the electric characteristics of the device. SOLUTION: The method of manufacturing the semiconductor device is composed of a main body wafer manufacturing process of manufacturing a wafer forming a semiconductor device which becomes a product, and a monitor wafer manufacturing process of manufacturing a wafer forming a monitor element and only shares a monitoring step. The main body wafer manufacturing process includes a variation reducing step and the monitor wafer manufacturing process includes a workmanship observing step and a conditions setting step. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109457(A) 申请公布日期 2005.04.21
申请号 JP20040259656 申请日期 2004.09.07
申请人 SEIKO INSTRUMENTS INC 发明人 ISHII KAZUTOSHI;OSANAI JUN;KITAJIMA YUICHIRO;MINAMI SHISHIYO;KAMIMURA KEISUKE;WAKE YOSHIKAZU
分类号 H01L21/66;G01R31/26;H01L21/00;H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/66
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