发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a high-quality semiconductor device can be manufactured at a high yield by reducing the variation of the electric characteristics of the device. SOLUTION: The method of manufacturing the semiconductor device is composed of a main body wafer manufacturing process of manufacturing a wafer forming a semiconductor device which becomes a product, and a monitor wafer manufacturing process of manufacturing a wafer forming a monitor element and only shares a monitoring step. The main body wafer manufacturing process includes a variation reducing step and the monitor wafer manufacturing process includes a workmanship observing step and a conditions setting step. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005109457(A) |
申请公布日期 |
2005.04.21 |
申请号 |
JP20040259656 |
申请日期 |
2004.09.07 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
ISHII KAZUTOSHI;OSANAI JUN;KITAJIMA YUICHIRO;MINAMI SHISHIYO;KAMIMURA KEISUKE;WAKE YOSHIKAZU |
分类号 |
H01L21/66;G01R31/26;H01L21/00;H01L21/02;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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