发明名称 RESIN COMPOSITION, CONDUCTIVE FOIL WITH RESIN, PREPREG, SHEET, SHEET WITH CONDUCTIVE FOIL, LAMINATED PLATE AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a resin composition having a low transmission loss (a low dielectric constant, a low dielectric loss) serviceable under high frequency conditions, good handling properties, high heat resistance, low water absorption and high flame retardancy, a conductive foil with a resin, a prepreg, a sheet, a sheet with the conductive foil, a laminated plate and a printed wiring board. SOLUTION: The resin composition comprises an oligomer (A) of a thermosetting polyphenylene ether, a flexibility-imparting agent (B) comprising at least one of polybutadiene and styrene-butadiene copolymers and a flame-retardant (C). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005105061(A) 申请公布日期 2005.04.21
申请号 JP20030337864 申请日期 2003.09.29
申请人 TDK CORP 发明人 KAWABATA KENICHI
分类号 C08J5/24;B32B15/08;C08L71/12;C09K21/08;C09K21/14;H05K1/03;H05K3/20;H05K3/46;(IPC1-7):C08L71/12 主分类号 C08J5/24
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