| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition and a coverlay which satisfy halogen-freeness and long lives under circumstances that there is an increasing demand for the elaborate wiring on a flexible printed circuit board, high-density mounting, flexibility, etc., as the electronic devices become higher in performance and smaller in size and that there is a demand for a halogen-free material to cope with an environmental problem. SOLUTION: The resin composition is one used for flexible printed circuit boards and comprises a biphenylaralkylepoxy resin, a bisphenol epoxy resin, a curing agent, and a cure accelerator represented by formula (1). COPYRIGHT: (C)2005,JPO&NCIPI
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