| 摘要 |
A packaging platform, and method for producing the platform, for integrating, aligning and securing two or more optical, optoelectronic and/or electronic components is provided. The platform provides features for positioning the these elements in the x, y and z directions. This platform can simplify the coupling of light from an optical or optoelectronic component to another optical or optoelectronic component or simplify the electrical coupling from an electronic or optoelectronic component to another electronic or optoelectronic component. This platform can also serve as the final packaging structure, which can be sealed or unsealed, for the integrated, aligned and/or secured optical, optoelectronic and electronic components, where said structure includes any required or desired optical, electrical and/or mechanical features.
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