| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multichip module in which many of multilayer chips are interconnected with ease and with cost reduction. <P>SOLUTION: This method comprises: a process of providing at least one contact bump 11 on a substrate 10; a process of applying rewiring elements 12 to the substrate 10 and the contact bump(s) 11, and of patterning for obtaining a contact element 13 (or contact elements 13); a process of providing semiconductor chips 15 on the substrate 10 which has electrical contact connection consisting of the rewiring elements 12; and a process of providing sealing elements 16 which exhibit no electrical conductivity on the semiconductor chips 15, the substrate 10, the rewiring elements 12, and the at lease one contact bump 11 so that one surface 16' makes contact with the contact element(s) 13. The first surface 16' of one sealing element 16 functions as a substrate. The rewiring elements 12 corresponding to the surface 16' are electrically connected to the contact element(s) 13 of the at least one contact bump 11 on the underlying flat surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
