| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus in which the simplification of a configuration and the reduction of heat loss in the furnace of a reformer can be realized, and the enhanced accuracy of a temperature measurement has been achieved. <P>SOLUTION: A heat treatment apparatus includes a heating resistor 47 that applies a heat to a raw material to be heat-treated within a flow passage in a chemical reactor, a diffusion preventing layer 47b for preventing a diffusion associated with the heat build-up of the heating layer underneath an heating layer 47a of the heating resistor, and an adhesion layer 47c for increasing an adhesion strength between the diffusion preventing layer and the surface of a substrate 41. It is preferable that substance comprising the heating layer contains Au, and substance comprising the diffusion preventing layer contains W. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
