| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed board that can improve the mechanical strength of a packaged IC in which a plurality of solder balls are arranged along a bottom face of the IC when the IC is mounted on the board, and to provide a mounting structure, an electrooptic device equipped with the mounting structure, and electronic equipment equipped with the electrooptic device. SOLUTION: An FPC 10 has a packaged-IC mounting area A for mounting the packaged IC. In the packaged-IC mounting area A, lands 13 are formed for soldering the solder balls of the packaged IC and the width of metallic wiring 14a connected to the lands 13a in the outer peripheral section of the packaged-IC mounting area A is adjusted to 1/2-1 times of the diameters of the lands 13a. COPYRIGHT: (C)2005,JPO&NCIPI |
