| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing exhibiting excellent adhesion to a frame pre-plated with Ni, and a semiconductor device using the same. SOLUTION: The epoxy resin composition comprises as essential ingredients (A) an epoxy resin represented by general formula (1) (wherein R<SB>1</SB>is a hydrogen atom, a 1-4C alkyl group or an allyl group; and n is 0 or an integer of at least 1), (B) a phenolic resin represented by general formula (2) (wherein R<SB>2</SB>, R<SB>3</SB>and R<SB>4</SB>are each a hydrogen atom or a 1-4C alkyl group and may be the same or different; and n is 0 or an integer of at least 1), (C) an inorganic filler and (D) a curing accelerator. COPYRIGHT: (C)2005,JPO&NCIPI |
