WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, SUBSTRATE JOINED BODY, METHOD FOR MANUFACTURING SUBSTRATE JOINED BODY, ELECTROOPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTROOPTICAL DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board whose height of bumps formed on a wiring pattern is made uniform so that the electric continuity between a TFT and the wiring pattern can be surely attained, a method for manufacturing the wiring board, a substrate joined body, a method for manufacturing the substrate joined body, an electrooptical device, and a method for manufacturing the electrooptical device. SOLUTION: The wiring board 3, wherein a switching element 13 is transferred and arranged on a plurality of conductive protrusions 14a formed on a terminal part of a prescribed wiring pattern 11, is so constituted that the plurality of conductive protrusions 14a are formed on the basis of a first parameter on the existence of adjacent conductive protrusions and a second parameter on the planar dimension of the bottom part of the conductive protrusions. COPYRIGHT: (C)2005,JPO&NCIPI