| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board exhibiting superior moisture absorption resistance and water resistance in which contact resistance between terminals is reduced. SOLUTION: The wiring board comprises a substrate 11, a wiring pattern 12 of conductive resin, principally comprising silver embedded in the substrate 11 to expose the surface part, and a coated conductor 13, principally comprising carbon formed to cover the surface part of the wiring pattern 12. With such an arrangement, prevention of migration of silver due to the effects of moisture and reduction in the contact resistance at the joint can be realized simultaneously. COPYRIGHT: (C)2005,JPO&NCIPI
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