发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that is capable of raising a reliability of mounting on a wiring substrate. One feature of the present invention is to bond a semiconductor element formed on a substrate having isolation to a member that a conductive film is formed via a medium having an anisotropic conductivity.
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申请公布号 |
US2005082655(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040951811 |
申请日期 |
2004.09.29 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
NISHI KAZUO;ADACHI HIROKI;KUSUMOTO NAOTO;SUGAWARA YUUSUKE;TAKAHASHI HIDEKAZU;YAMADA DAIKI;HIURA YOSHIKAZU |
分类号 |
H01L27/14;H01L21/60;H01L23/12;H01L23/498;H01L27/146;H01L31/0203;H01L31/04;H01L31/10;(IPC1-7):H01L29/792 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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