发明名称 |
Die bonding apparatus and method for bonding semiconductor chip using the same |
摘要 |
A die bonding apparatus may include a bond head providing a heating function. The bond head may include a die collet for picking up a semiconductor chip when performing a die bonding process. The die collet may heat the semiconductor chip by using heat transmitted from the bond head when picking up the chip. The die collet may also provide a heating function for heating the chip.
|
申请公布号 |
US2005081986(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040885768 |
申请日期 |
2004.07.08 |
申请人 |
KWON HEUNG-KYU;KIM SE-NYUN;YOON KI-MYUNG |
发明人 |
KWON HEUNG-KYU;KIM SE-NYUN;YOON KI-MYUNG |
分类号 |
H01L21/52;H01L21/00;H01L21/58;H01L21/68;(IPC1-7):C09J1/00;B32B31/00 |
主分类号 |
H01L21/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|