发明名称 |
Halbleitervorrichtung mit einem Halbleiterchip |
摘要 |
A semiconductor device includes an insulating substrate 2 having an obverse surface formed with a die pad 3 , a rectangular semiconductor chip 7 such as an LED chip bonded to the die pad with a die bonding material 10 , and a molded portion 9 made of a synthetic resin for packaging the semiconductor chip. The die pad 3 may be rectangular with dimensions close to those of the semiconductor chip or circular with a diameter close to the diagonal dimension of the semiconductor chip, whereby the positioning and orienting of the semiconductor chip can be accurately performed in bonding the semiconductor chip. |
申请公布号 |
DE10392365(T5) |
申请公布日期 |
2005.04.21 |
申请号 |
DE2003192365T |
申请日期 |
2003.02.24 |
申请人 |
ROHM CO. LTD., KYOTO |
发明人 |
ISOKAWA, SHINJI;YAMAGUCHI, TOMOJI |
分类号 |
H01L23/498;H01L33/38;H01L33/48;H01L33/62 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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