| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for dressing an abrasive cloth allowing uniform and efficient dressing within a plane of the abrasive cloth stuck to a polishing plate of a wafer polishing device to obtain a wafer of high quality with desired flatness with good yield in the wafer polishing device. <P>SOLUTION: A plurality of plate-like dressing members 1 with diamond abrasive grains electro-deposited are disposed at equal spaces, and while moving the dressing members 1 in the radial direction of the rotating polishing plate 4, the surface of the abrasive cloth and the abrasive grain surfaces of the dressing members are slid to perform dressing. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
