| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a reliable printed wiring board when a semiconductor element is subjected to flip-chip packaging to the printed wiring board, to provide a semiconductor device, and to provide methods for manufacturing the printed wiring board and the semiconductor device. <P>SOLUTION: The printed wiring board comprises a metal plate 11 having an opening 11a; a multilayer wiring layer 23 that is laminated on the metal plate, while a plurality of wiring layers and insulating layers are laminated alternately and the wiring layers are connected by vias; a plurality of first conductive pads 15 that are formed in the opening of the metal plate on the first surface in the multilayer wiring layer in which the metal plate is provided and are formed in a projecting shape projecting from the first surface; and a plurality of second conductive pads 22 formed on a second surface at a side opposite to the first surface. A first metal-plated layer 12 and a second metal-plated layer 13 are interposed between the metal plate and the multilayer wiring layer successively from the metal plate side, and the first metal-plated layer is made of metal having selection ratio in etching to at least the metal plate and the second metal-plated layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
