发明名称 SURFACE MOUNTED SEMICONDUCTOR PACKAGE AND CHARGE CONTROL CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To control charge of secondary batteries with simpler circuit configurations. SOLUTION: A semiconductor integrated chip 13 formed of a surface mounted semiconductor package is attached to a circuit board 12 equipped with a heat radiating land 11. A power transistor 15 which controls charging of a secondary battery 50 is mounted within the semiconductor chip 13. Since the power transistor for controlling the charging of the secondary battery is mounted within the semiconductor chip, this makes the circuit configuration simpler and the circuit size smaller to a large extent than the case in which the power transistor is prepared separately from the semiconductor chip for drive control. Thus this is helpful for downsizing and cost reduction of electronic information equipment carrying secondary batteries. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005108683(A) 申请公布日期 2005.04.21
申请号 JP20030341706 申请日期 2003.09.30
申请人 MITSUMI ELECTRIC CO LTD 发明人 NAGAI TOMIYUKI
分类号 H01M10/44;(IPC1-7):H01M10/44 主分类号 H01M10/44
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