| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein the position at which an underfill is applied on a substrate is not kept constant relative to a mounted chip, if deviation in mounting position of the chip or variation in size of the chip occurs, after the position at which the underfill is applied is decided, based on a mark provided on the substrate, in advance. SOLUTION: A chip is mounted on a substrate by a chip mounting apparatus, comprising a marking mechanism with a constant value on distance from the side of the chip, at the same time, when a mark is applied. So, an underfill can be accurately applied to the side of the mounted chip. COPYRIGHT: (C)2005,JPO&NCIPI
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