发明名称 Apparatus for electroless deposition
摘要 Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.
申请公布号 US2005081785(A1) 申请公布日期 2005.04.21
申请号 US20040965220 申请日期 2004.10.14
申请人 APPLIED MATERIALS, INC. 发明人 LUBOMIRSKY DMITRY;SHANMUGASUNDRAM ARULKUMAR;PANCHAM IAN A.;LOPATIN SERGEY
分类号 B05C3/00;B05C19/02;C23C18/16;C23C18/28;C23F1/00;C25D7/12;H01L21/288;H01L21/768;(IPC1-7):B05C3/00 主分类号 B05C3/00
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