| 摘要 |
FIELD: manufacture of high-reliability electronic components including warranted ones. ^ SUBSTANCE: proposed method for testing electronic components, among them being chip and packaged multicontact ones with arbitrary pitch and location of contact pads or external leads, including electric and thermal pre-burning and check-up of components under test, involves use of baseplate for the purpose that incorporates permanent electronic components affording generation of input signals and processing of output ones for next tests and checks of components. Components under test are disposed in baseplate ports, secured therein, and temporary conductors are evaporated in vacuum to connect components under test to baseplate conductors. Upon tests and checks temporary conductors are removed and serviceable components produced in this way are extracted from baseplate ports; then baseplate is reused many times for testing and checking next lots of similar components. ^ EFFECT: enhanced quality of electronic components being manufactured. ^ 13 cl, 7 dwg |
