发明名称 |
Etching in combination with other processing techniques to facilitate alignment of a die in a system and structures formed thereby |
摘要 |
Etching in combination with other processing techniques is used to facilitate alignment of an optical die in an optical system. The optical dies are formed on a wafer level and need to be singulated for use in the optical system. The formation of a precise edge from etching allows more accurate alignment of the optical die in the optical system. The other processing techniques include dicing, sawing, cleaving, breaking and thinning.
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申请公布号 |
US6881600(B2) |
申请公布日期 |
2005.04.19 |
申请号 |
US20030628575 |
申请日期 |
2003.07.29 |
申请人 |
DIGITAL OPTICS CORP |
发明人 |
FELDMAN MICHAEL R.;MORRIS JAMES E.;HAN HONGTAO;CHEN XIANSONG;YANG YINBAO |
分类号 |
G02B6/36;G02B6/42;(IPC1-7):H01L21/00;G01R31/26 |
主分类号 |
G02B6/36 |
代理机构 |
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