发明名称 Semiconductor device with analog capacitor and method of fabricating the same
摘要 A semiconductor device having an analog capacitor and a method of fabricating the same are disclosed. The semiconductor device includes a bottom plate electrode disposed at a predetermined region of a semiconductor substrate, and an upper plate electrode having a region overlapped with the bottom plate electrode thereon. The upper plate electrode and the bottom plate electrode are formed of a metal compound. A capacitor dielectric layer is interposed between the bottom plate electrode and the upper plate electrode. A bottom electrode plug and an upper electrode plug are connected to the bottom plate electrode and the upper plate electrode through the interlayer dielectric layer.
申请公布号 US6881999(B2) 申请公布日期 2005.04.19
申请号 US20030393093 申请日期 2003.03.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE KI-YOUNG;PARK SANG-HOON
分类号 H01L21/02;H01L21/768;H01L27/08;(IPC1-7):H01L21/824 主分类号 H01L21/02
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