发明名称 |
System for forming a semiconductor device and method thereof including implanting through a L shaped spacer to form source and drain regions |
摘要 |
A method for fabricating sidewall spacers in the manufacture of an integrated circuit device is disclosed. A dielectric spacer layer is formed over the semiconductor substrate. The dielectric spacer layer is etched prior to forming a layer subsequent to the dielectric layer, to form an L-shaped spacer. In another embodiment, a structure is formed on a substrate, the structure having a sidewall portion that is substantially orthogonal to a surface of the substrate. A dielectric layer is formed over the substrate. A spacer is formed over a portion of the dielectric layer and adjacent to the sidewall portion of the structure, wherein at least a portion of the dielectric layer over the substrate without an overlying oxide spacer is an unprotected portion of the dielectric. At least a part of the unprotected portion of the dielectric layer is removed. An intermediate source-drain region can be formed beneath a portion of the L-shaped spacer by controlling the thickness and/or the source drain doping levels.
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申请公布号 |
US6881616(B1) |
申请公布日期 |
2005.04.19 |
申请号 |
US20020058854 |
申请日期 |
2002.01.28 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
HELLIG KAY;BONSER DOUGLAS J.;QI WEN-JIE |
分类号 |
H01L21/311;H01L21/336;H01L21/338;H01L21/8234;H01L29/78;(IPC1-7):H01L21/338 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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