HYBRID STRUCTURE FOR DISTRIBUTED POWER AMPLIFIERS

摘要

A hybrid low voltage distributed power amplifier structure (300) provides improved efficiency by forming drain transmission line inductors (323) on a substrate (306) while the rest of the amplifier is built in IC form (302). A wirebond interconnection (330) is made between the IC s drainline capacitors (324) and the substrate s drainline inductors (323) which are a higher impedance point in the circuit. As a result, the wirebond inductance becomes negligible and has little or no impact on the power amplifier's performance.