BGA SOCKET TEST SYSTEM

摘要

A test system of a BGA(Ball Grid Array) socket is provided to apply heat to the BGA, to intercept the BGA, and to detect a thermal change according to time by using an infrared camera, thereby capable of detecting a ball having a defect such as open or short. A heat source supply and transfer device(30) supplies or intercepts heat to each hole of a BGA type socket(20) and transfers the heat up and down. An infrared camera(50) applies heat to each ball of the BGA type socket on a PCB(Printed Circuit Board)(10) and senses the thermal change according to the time after the interception of the applied heat. The heat source supply and transfer device has plural supply tubes discharged from a chamber having a heater and connected to each hole of the BGA type socket.