| 发明名称 |
Polishing pad |
| 摘要 |
A polishing pad is useful planarizing semiconductor substrates. The polishing pad comprises a polymeric material having a porosity of at least 0.1 volume percent, a KEL energy loss factor at 40° C. and 1 rad/sec of 385 to 750 l/Pa and a modulus E' at 40° C. and 1 rad/sec of 100 to 400 MPa.
|
| 申请公布号 |
US2005079806(A1) |
申请公布日期 |
2005.04.14 |
| 申请号 |
US20040937914 |
申请日期 |
2004.09.10 |
| 申请人 |
JAMES DAVID B.;KULP MARY JO |
发明人 |
JAMES DAVID B.;KULP MARY JO |
| 分类号 |
B24B37/04;B24D3/26;B24D13/14;C08G18/10;C08G18/48;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
