发明名称 |
Copper CMP flatness monitor using grazing incidence interferometry |
摘要 |
A system and method for in-line inspection of specimens such as semiconductor wafers is provided. The system provides scanning of sections of specimens having predetermined standardized characteristics using a diffraction grating that widens and passes nth order (n>0) wave fronts to the specimen surface and a reflective surface for the transmitted light beam. Light energy is transmitted in a narrow swath across the portion of the surface having the standardized features. The wavefronts are combined using a second diffraction grating and passed to a camera system having a desired aspect ratio.
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申请公布号 |
US2005078320(A1) |
申请公布日期 |
2005.04.14 |
申请号 |
US20040968711 |
申请日期 |
2004.10.18 |
申请人 |
MUELLER DIETER;KREN GEORGE;AFFENTAUSCHEGG CEDRIC |
发明人 |
MUELLER DIETER;KREN GEORGE;AFFENTAUSCHEGG CEDRIC |
分类号 |
G01B11/30;G01N21/95;H01L21/66;(IPC1-7):G21G5/00 |
主分类号 |
G01B11/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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