发明名称 METHOD OF FORMING A METAL LAYER USING AN INTERMITTENT PRECURSOR GAS FLOW PROCESS
摘要 <p>A method is provided for forming a metal layer on a substrate using an intermittent precursor gas flow process. The method includes exposing the substrate to a reducing gas while exposing the substrate to pulses of a metal-carbonyl precursor gas. The process is carried out until a metal layer with desired thickness is formed on the substrate. The metal layer can be formed on a substrate, or alternately, the metal layer can be formed on a metal nucleation layer.</p>
申请公布号 WO2005034224(A1) 申请公布日期 2005.04.14
申请号 WO2004US28893 申请日期 2004.09.07
申请人 TOKYO ELECTRON LIMITED;INTERNATIONAL BUSINESS MACHINES CORPORATION;YAMASAKI, HIDEAKI;MATSUDA, TSUKASA;GOMI, ATSUSHI;HATANO, TATSUO;TACHIBANA, MITSUHIRO;MATSUZAVA, KOUMEI;KAWANO, YUMIKO;LEUSINK, GERT, J.;MCFEELY, FENTON, R.;MALHOTRA, SANDRA, G.;SIMON, ANDREW, H.;YURKAS, JOHN, J. 发明人 YAMASAKI, HIDEAKI;MATSUDA, TSUKASA;GOMI, ATSUSHI;HATANO, TATSUO;TACHIBANA, MITSUHIRO;MATSUZAVA, KOUMEI;KAWANO, YUMIKO;LEUSINK, GERT, J.;MCFEELY, FENTON, R.;MALHOTRA, SANDRA, G.;SIMON, ANDREW, H.;YURKAS, JOHN, J.
分类号 C23C16/04;C23C16/16;C23C16/44;C23C16/455;H01L21/285;H01L21/768;(IPC1-7):H01L21/285 主分类号 C23C16/04
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