| 摘要 |
PROBLEM TO BE SOLVED: To provide such a controller that can suppress a packaging resin material as much as possible, reduce cost and realize weight reduction by cast processing for only a part, wherein the packaging resin is made open to the usage environmental atmosphere of a control substrate without limiting the wiring of a printed board by designing the structure of a controller for resin packaging, and that can improve the realiability of dust proofing and moisture resistance. SOLUTION: The controller is provided with a control substrate wherein electronic parts are mounted, a case wherein a mounting surface side of the control substrate housing the control substrate is made open, a packaging resin for protecting the electronic parts of the control substrate, and an entry prevention means that is adhered to the surface of the rear side of the control substrate on the entire circumference along the inner circumferential surface of the bottom of the case where the control substrate is housed while the electronic parts of the control substrate is covered with the packaging resin. COPYRIGHT: (C)2005,JPO&NCIPI
|
