| 摘要 |
<P>PROBLEM TO BE SOLVED: To make the heights of hard bump electrodes formed on a circuit board by plating etc., equal to each other by a simple method without exposing metallic films in the electrodes and may cause defective mechanical junction with semiconductor elements when the films are exposed, nor producing cracks which may cause defective electrical connection with the semiconductor elements in the surfaces of the bump electrodes. <P>SOLUTION: After metallic layers 2 and 5 which become the base layers of the bump electrodes 13 are formed on the surface of the circuit board 1, the heights of the metallic layers 2 and 5 are made equal to each other by pressing a flattening jig 7 against the layers 2 and 5. Then the bump electrodes 13 are formed by laminating metallic films 12 upon the surfaces of the metallic layers 2 and 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
