| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is high in manufacturing efficiency, and to provide a method of manufacturing the device, a wiring board, a circuit board, and electronic equipment. <P>SOLUTION: A wiring board 10 having wiring patterns, areas 30 for mounting semiconductor chips, and positioning marks 20 disposed by avoiding the areas 30 is prepared. Then the semiconductor chips are respectively mounted on the areas 30 by utilizing the positioning marks 20. The marks 20 are respectively disposed at the intersections of first virtual lines 22 extended in parallel with each other at fixed intervals and second virtual lines 24 disposed at fixed intervals perpendicularly to the first virtual lines 22. The areas 30 for mounting the semiconductor chips are respectively disposed in areas surrounded by two adjacent first virtual lines 22 and two adjacent second virtual lines 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
