| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma device for processing a plurality of substrates simultaneously without any problem in quality, and also economically by using plasma because it is hard to use liquid, if a hole diameter is small, even though it is necessary to remove residues inside holes prior to the plating of copper or the like after forming a through-hole or a via with a small diameter by laser or the like, when forming a fine circuit pattern on a resin substrate. <P>SOLUTION: On the plasma device, a plasma density is increased by applying a pulse voltage with high rising and falling speed on a primary side by using a pulse transformer and by accelerating rising and falling of output voltages at output terminals of both ends of a coil by grounding the coil center of a secondary side, and heat generation is restrained by controlling the period of turned on and turned off of the pulse voltage. Plasma treatment can be conducted very economically and effectively, since the plasma treatment is uniformly carried out by connecting a number of electrodes to the secondary side output terminal through a capacitor, in order to processing a number of substrates simultaneously by single power source. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
