I/O TERMINAL, PACKAGE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an I/O terminal for improving the operability of a semiconductor element by supplying a large DC power to a thermoelectric cooling element without damaging airtightness of a package. SOLUTION: In the I/O terminal 4 constituted of a planar part 4b having a line conductor 4a on the upper surface and a standing wall part 4c, the planar part 4b is formed by laminating a plurality of ceramic layers 4b-1 and provided with an inner layer conductor layer 4a-1 wherein cuts 4g-2 and 4g-3 are provided in the opposite end faces and conductor layers 4b-2 and 4b-3 are formed on the inner surface thereof. The cuts 4g-2 and 4g-3 are narrower than the central part of the inner layer conductor layer 4a-1 having an end part becoming narrower gradually toward the cuts 4g-2 and 4g-3 and having a width identical to that of the cuts 4g-2 and 4g-3 at the forward end. One cut 4g-2 is semicircular as viewed from above at the deepest part and has a length A longer than the length B at the end part of the inner layer conductor layer 4a-1. COPYRIGHT: (C)2005,JPO&NCIPI