FLIP CHIP MOUNTING STRUCTURE, SUBSTRATE FOR MOUNTING THE SAME, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a flip chip mounting structure, substrate for mounting the same and a method of manufacturing the same for enabling stable electrical connection through sufficient connections between the element side electrode bump of semiconductor element and substrate side electrode in the flip chip mounting. SOLUTION: The flip chip mounting structure is formed by mounting semiconductor elements and a plurality of element side electrodes which are concentrated to a single plane and provided on a flip chip semiconductor element to form a mound contact using a mounting substrate including a plurality of substrate side electrodes to be electrically and mechanically connected to the element side electrode via a connection metal. This flip chip mounting structure is characterized in providing a concave part in the substrate side electrode for feeding a metal material for joint at the time of flip chip mounting. COPYRIGHT: (C)2005,JPO&NCIPI