发明名称 ADSORPTION POWER REDUCTION METHOD BETWEEN SUBSTRATES, NEAR-FIELD EXPOSURE METHOD, AND NEAR-FIELD EXPOSURE SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a adsorption power reduction method, a near-field exposure method and a near-field exposure system which reduce elastic deterioration which makes a mask for near-field exposure especially in exposure result in teardown, by reducing adsorption power between the substrates in the state of adhesion and enabling exfoliation, and can increase the number of times of using durability. SOLUTION: The near-field exposure method or equipment has a process for reducing the adsorption power which acts between the exposure mask and resist when the exposure mask is exfoliated from the resist. It is constituted to have a process for performing the assistance of exfoliation of the exposure mask, on the basis of the state of adsorption between the mask and the resist. The state of adsorption is detected from the difference between the physical quantity necessary for adhering the mask to the resist and physical quantity necessary for exfoliating the mask from the resist and/or deformation quantity of the mask to the resist. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005101133(A) 申请公布日期 2005.04.14
申请号 JP20030331006 申请日期 2003.09.24
申请人 CANON INC 发明人 AOKI SHUJI
分类号 G03F7/20;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/20
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