| 摘要 |
PROBLEM TO BE SOLVED: To provide shield structure of an electronic apparatus which can realize the reduction of required packing area, the reduction of routing and improvement in shieldability. SOLUTION: A shield 4 which applied an electric conduction coat 3 to a frame 2 is formed, and circuit components 9 on a multilayer printed board 5 are held in the shield part 4. A connection terminal 6 in which a pin type rib 6A and an elastic structure body 6B are integrated is formed in the frame 2, and the rib 6A electrically conducts with the electric conduction coat 3. The rib 6A is inserted into a through hole of the multilayer printed board 5 and compressively bonded to an earth 7 of the multilayer printed board 5 by an elastic structure body 6B. The rib 6A has function also for positioning with the lead frame 2 and the multilayer printed board 5. COPYRIGHT: (C)2005,JPO&NCIPI
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