| 摘要 |
A solder alloy based on an Sn-Zn-In-Ag system contains, in weight, 3.0%<Zn<5.0%, 0.1%<In<4.0%, 0.1%<Ag<0.4%, and the balance Sn. Therefore, the current Sn-Pb soldering method can be employed as it is. Further, a Pb-free solder material having a solder characteristic with excellent bonding strengths of the parts can be provided. Still further, since a difference between a solidus temperature and a liquidus temperature is small, floating of the parts leads can be suppressed, even in case where packaging processes are performed many times over. Still further, when the joint is exposed to the high temperature and high humidity atmosphere, the bonding strength can be prevented from being lowered.
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