发明名称 LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE SYSTEM HAVING AT LEAST TWO HEAT SINKS
摘要 There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.
申请公布号 WO2004107461(B1) 申请公布日期 2005.04.14
申请号 WO2004KR01153 申请日期 2004.05.14
申请人 SEOUL SEMICONDUCTOR CO., LTD.;HAN, KWAN YOUNG;PARK, KWANG IL;CHO, JAE HO;SEO, JUNG HOO;RYU, SEONG RYEOL 发明人 HAN, KWAN YOUNG;PARK, KWANG IL;CHO, JAE HO;SEO, JUNG HOO;RYU, SEONG RYEOL
分类号 H01L33/50;F21K7/00;H01L25/075;H01L33/56;H01L33/58;H01L33/62 主分类号 H01L33/50
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