IMPROVED METHOD FOR MICRO-ROUGHENING TREATMENT OF COPPER AND MIXED-METAL CIRCUITRY

摘要

Process to improve adhesion of dielectric materials to a metal layer, including providing an unpatterned metal layer having a first major surface; micro-roughening the first major surface to form a micro-roughened surface; and etching the metal layer to form a circuit pattern in the metal layer, in which the micro-roughening is carried out prior to the etching.