| 发明名称 |
ADHESIVE COMPOSITION |
| 摘要 |
<p>The present invention aims to provide an adhesive composition enabling to obtain a cured product having good adhesion properties. The present invention secondarily aims to reduce the amount of adhesive resin to be used by providing it with such good adhesion properties. The adhesive composition essentially contains (A) a polyoxyalkylene polymer having at least one alkenyl group in one molecule, (B) a compound having 1-3 hydrosilyl groups in one molecule on average, and (C) a hydrosilylation catalyst.</p> |
| 申请公布号 |
WO2005033239(A1) |
申请公布日期 |
2005.04.14 |
| 申请号 |
WO2004JP14145 |
申请日期 |
2004.09.21 |
| 申请人 |
KANEKA CORPORATION;UEDA, KAZUHIKO;KOMITSU, SHINTARO |
发明人 |
UEDA, KAZUHIKO;KOMITSU, SHINTARO |
| 分类号 |
C09J7/02;C09J171/02;C09J183/05;(IPC1-7):C09J171/02 |
主分类号 |
C09J7/02 |
| 代理机构 |
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