| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor chip which can divide a semiconductor wafer in which a bonding film is adhered to the rear surface without causing chipping at the rear surface and the lowering of an operation life of a cutting blade. SOLUTION: In the method for manufacturing a semiconductor chip, a plurality of streets 21 are formed in a shape of a lattice on the front surface, and a semiconductor wafer on which circuits 22 are formed in a plurality of regions segmented by the plurality of streets 21 is divided into individual semiconductor chips. This semiconductor chip manufacturing method comprises a bonding film adhering process for adhering a bonding film 3 to the rear surface of the semiconductor wafer, a street cutting process to form a cutting groove 23 by cutting the semiconductor wafer from the surface thereof along the street leaving a cutting allowance 24 in a predetermined thickness in the rear surface side, and a cutting process for cutting the cutting allowance and bonding a film by irradiating the cutting allowance 24 of the cutting groove 23 formed along the street 21 with a laser beam. COPYRIGHT: (C)2005,JPO&NCIPI |
